| abstract |
Disclosed is a photosensitive resin composition containing a polyimide (a) having, at an end of the main chain, at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, an unsaturated bond-containing polymerizable compound (b1) represented by the general formula (1) below, and a photopolymerization initiator (c). This photosensitive resin composition enables to form an alkaline-developable polyimide film having excellent heat resistance, strength and ductility. |