| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9bf3c3e6cca1de3cbce95c56a46baca3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6311681c0ceb805c5259fc5183e34289
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_00793eaeabd30f7bb1e88964f1565772
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_845d0c91abb5f3f5a0ea9abfbf9f531b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F222-40 |
| filingDate |
2006-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_881055de63e4ad610367978d9b72903a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a265c562a0a5be38ac7bfaf5d6591d14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08119c8015f1e0925a053989c57c8b35 |
| publicationDate |
2006-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2006088612-A1 |
| titleOfInvention |
Bismaleimire resin with high temperature thermal stability |
| abstract |
The present invention is for the use of aliphatic bismaleimide compounds in epoxy resin systems to increase the thermal aging properties of a cured resin system through reduced microcracking as measured by reduced weight loss after thermal aging. The present invention further provides a BMI resin formulation with no undissolved solid BMI, but which retains equivalent mechanical properties as BMI resin formulations incorporating slurried solid BMI particles. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9701815-B2 |
| priorityDate |
2005-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |