| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e3638bbaca695d1e0ccce54c8e63a9c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_022f4b235d591d08e5c0aeb6b793a832
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d9f3ca41550d315642580237250c5b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9f4fdfca46e0eef7c02c4ee5f3e5bd53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f5f107487518b0d4745c0b3406c0f056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_69cbe42f4ddfceb78e0cbdf4033c40cf |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03C1-853
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03C1-4989
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03C1-49872 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C1-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C1-85 |
| filingDate |
2006-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7cef7740c005d60b61a381b732326eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7d1f868ddcc5bff22e89bbb14c42f83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be74999e1b70fcbb0931b45309700cb0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a801793f0d28910fb8353c6187a48689
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f46d5e2b79d01f20bb1c999911710fc |
| publicationDate |
2006-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2006086162-A1 |
| titleOfInvention |
Thermally developable materials with improved conductive layer |
| abstract |
Buried backside conductive layers with increased conductive efficiency can be provided for thermally developable materials using a specific organic solvent mixture to coat a protective overcoat directly disposed over the conductive layer. This organic solvent mixture comprises an alcohol in which one or more film-forming polymers used in the formulation are soluble at room temperature. The alcohol is used in an amount of more than 10 and up to 90 weight % of the organic solvent mixture. |
| priorityDate |
2005-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |