| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5743df4eeb1962f1269218746b2781c2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a0d04072f225f4b16254c82add1c8eb4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_399d433982220f3203f7f18db8c9aa28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3685747f0bf9dee5b94016a116602960 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-249992
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-249991
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-249989 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L75-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-14 |
| filingDate |
2006-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dce0d43967fe8b67937fb073b63da813
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48452daa1893ba616bc76897ea4a6007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea5bd2ff4165260b2e57a44b2828aaea |
| publicationDate |
2006-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2006085614-A2 |
| titleOfInvention |
Cushioning material for polishing pad |
| abstract |
Disclosed is a cushioning material for polishing pads which hardly suffers swelling deformation caused by water since it is extremely low in water-absorbing properties and water-swelling properties. This cushioning material for polishing pads is composed of a polyurethane foam which is capable of polishing even a semiconductor wafer having an undulated surface or a wafer having a local step that is formed during circuit formation so that the undulation or step becomes shallower by uniformly polishing the entire surface of the wafer along the undulation or step. Specifically disclosed is a polyurethane foam obtained by reaction between a polyol and a polyisocyanate which is characterized by having a contact angle with water of not less than 90˚. The polyurethane foam is preferably made by using a hydrophobic polyol, and it is also preferable that the polyurethane foam has a self-skin layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011213924-A |
| priorityDate |
2005-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |