| abstract |
The disclosure is directed to a radiation curable composition including abrasive grains and a binder composition. The binder composition includes about 10 wt% to about 90 wt% cationically polymerizable compound, not greater than about 40 wt% radically polymerizable compound, and about 5 wt% to about 80 wt% particulate filler based on the weight of the binder composition. The particulate filler includes dispersed submicron particulates. |