| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c922e05f6133b7d72dbb849d77487d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P20-582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-26 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/E04H17-165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/E04H17-1452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-325
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F230-085 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate |
2006-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_379c0fbba6980a77bf17b571bac36c40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e5db4a86183f957907f1bb9b03843e9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c93460b99393911f32187ca301d728f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_475afaf3a5bf1482cfd2eb3b4bcd7b5e |
| publicationDate |
2009-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2006080786-A9 |
| titleOfInvention |
Thermally curable resin composition with extended storage stability and good adhesive property |
| abstract |
This invention provides a thermally curable resin copolymer (A), composed mainly of an ethylenically unsaturated monomer (a-1), which produces an acid via decomposition at 150°C or more, an ethylenically unsaturated monomer (a-2) containing an epoxy group copolymerizable with the ethylenically unsaturated monomer (a-1), and an ethylenically unsaturated monomer (a-3) having a reactive silyl group; a thermally curable resin composition including the thermally curable resin copolymer; a cured film formed from the composition; and a liquid crystal display including the cured film. The thermally curable resin composition has extended storage stability and can be formed into the cured film having good adhesion to a substrate. |
| priorityDate |
2005-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |