| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_88eea4e41ae4204911d56558b2e81f9c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4833cc3748c3f7f59e4c939a346952ae |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 |
| filingDate |
2006-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a2eaece5e91c9688fecab7afe536ba5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b98170c13fe1840ba07ac66a4a8c647 |
| publicationDate |
2006-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2006080388-A1 |
| titleOfInvention |
Electronic element package manufacturing method and electronic element package |
| abstract |
By connecting a base member (2) to a cover member (3), an internal electrode (51) in contact with the cover member (3) and an electronic element (41) connected to the internal electrode are arranged in an internal space (61) between the base member and the cover member. A through hole (32) reaching the surface of the internal electrode is formed by etching a surface (31) of the cover member opposing to the base member by a predetermined method. A conductive member is attached to the through hole and an external electrode connected to the internal electrode is formed on the surface. Thus, a thin electronic element package (1) is completed. |
| priorityDate |
2005-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |