| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_90a1c89d1e858b0e12a5fda4a9b4f74c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_26382761c8b043b9ac3dc3103c7fac5f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_66e8fb5dea592929c2a360fd1c214931
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fb6c56d58c3824fa78565398ea0f263f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6553f9a86c9fe3170954b2f33826289a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0537
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-096 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2005-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_070655388e0e331852a0482cfc54d5bd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_937d12efbe723a72061abfa954ed7536
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c6df0d90ff7c40bbe859dc8f661594c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78401787801f79d603cb84900d1eb4c4 |
| publicationDate |
2006-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2006070807-A1 |
| titleOfInvention |
Wiring board and wiring board manufacturing method |
| abstract |
A wiring board (1) has a wiring laminated part (6) where a dielectric layer and a conductive layer are built up at least on one major surface of a board core part (2). The wiring laminated part (6) includes a composite laminated portion (8) where a polymer material dielectric layer (3A), a conductive layer (4B), and a ceramic dielectric layer (5) are built up in order of mention from the board core part (2) side in contact with one another. The conductive layer (4B) of the composite laminated portion (8) has a conductor-side cut (18) formed by cutting a part of the conductive layer (4B) in a direction parallel to the conductive layer (4B), and the ceramic dielectric layer (5) has a ceramic-side cut (16) formed by cutting a part of the ceramic dielectric layer (5) in a direction parallel to the ceramic dielectric layer (5), thus forming a communication cut (21) where the ceramic-side cut (16) and the conductive-side cut (18) communicate with each other. The polymer material forming the polymer material dielectric layer (3A) is placed in the communication cut (21) in such a way that it extends through the conductor-side cut (18) to the ceramic-side cut (16). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8455766-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2178116-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2178116-A1 |
| priorityDate |
2004-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |