| abstract |
A chip or the like is vacuum packaged by accommodating the chip in the first chamber of a pre final assembly module, which cooperates with a lower cover having a getter, to provide a second chamber. The module has one or more passages for enabling fluid communication between the first chamber and the second chamber. Prior to joining and sealing the lower cover to the module at vacuum conditions, the getter is activated also under substantially vacuum conditions and while said module is spaced with respect to the lower cover. |