| abstract |
Disclosed herein is a surface modification method of a polyimide film by dipping a polyimide film into a solution containing a diamine compound, a method of manufacturing a flexible copper clad laminate having a two-layered structure, using the above method, and a flexible copper clad laminate manufactured thereby. The surface modification method of a polyimide film includes dipping a polyimide film into a solution containing a specific diamine compound, and therefore, may simplify conventional surface modification method of a polyimide film. In addition, since the flexible copper clad laminate of the invention has a two-layered structure formed through copper sputtering and electroplating on the surface modified polyimide film, it has excellent adhesive strength between the copper foil and the polyimide film, it may be usefully applied to electronic parts, such as flexible printed circuit boards, TCPs (Tape Carrier Packages), COFs (Chips On Film) , etc. |