Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_022f4b235d591d08e5c0aeb6b793a832 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e3638bbaca695d1e0ccce54c8e63a9c http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_69cbe42f4ddfceb78e0cbdf4033c40cf http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_059ade0c4e33597d828331ec5ea7ecde http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d9f3ca41550d315642580237250c5b0 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M2205-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M5-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M5-426 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M2205-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M5-40 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03C1-4989 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03C1-49872 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41M5-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C1-498 |
filingDate |
2005-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5bafecb25206070914964b642b7286ed http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76c09be915d0902bf533b23907746f43 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0fd327d7280211f9f59d752d98bf9e0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e27627a02a7c736423afaa2c40c384a |
publicationDate |
2006-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2006049866-A1 |
titleOfInvention |
Thermally developable materials with improved conductive layer |
abstract |
Backside conductive layers with increased conductive efficiency can be provided for thermally developable materials by formulating hydrophilic metal oxide clusters in a hydrophobic environment using low shear mixing conditions. The dry thickness and coating weight of the conductive layer are thereby reduced. |
priorityDate |
2004-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |