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filingDate 2005-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2006-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2006046386-A1
titleOfInvention Film forming method, semiconductor device manufacturing method, semiconductor device, program and recording medium
abstract Bonding between a Cu diffusion preventing film and a Cu wiring in a semiconductor device is improved and reliability of the semiconductor device is improved. A film forming method for forming a Cu film on a substrate to be processed is provided with a first process of forming a bonding film on the Cu diffusion preventing film formed on the substrate to be processed, and a second process of forming a Cu film on the bonding film. The bonding film includes Pd.
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priorityDate 2004-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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