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filingDate 2005-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_773d0ad0e91f251b741572b9983f74db
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publicationDate 2006-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2006034253-A1
titleOfInvention Low-emission adhesive composition based on a solvent
abstract Described is a low-emission adhesive, whose polymers are dissolved in a mixture of acetone and ethanol. The adhesive is characterized by very low emissions of solvents, with otherwise equally good properties compared to standard solvent-synthetic resin based adhesives. In particular with respect to viscosity and spreadability, surface tension, depth of penetration, wettability, simplicity and speed of processing, as well as adhesion, gluing strength and adhesive spectrum, the adhesive of the invention is equal to other adhesives based on solvents and thus superior to dispersion-adhesives that are based on aqueous solutions. Due to its low solvent emissions and absence of chlorinated solvents, the present adhesive is suitable for applications for which only dispersion-adhesives that are based on aqueous dispersions were reserved until now. This is true in particular for applications in enclosed spaces. The adhesive is very suitable for gluing of wooden floors in internal construction work.
priorityDate 2004-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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