| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_81d71e08de34a77d2652dd0b6179c64c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eb141b396e502bfce986c491d722e401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6eae70c004e56c1b01cf73ef3928107c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ff954adb0afbf5ee1f3ce7de9ba7f3b4 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J47-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01D61-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J47-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N33-543 |
| filingDate |
2005-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b368994fa869748a76a5aac42205b9e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ef9288de08a4663775cd4da2801ce0a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8073b1d30cc166cf57b0f0c584111f09 |
| publicationDate |
2006-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2006033954-A1 |
| titleOfInvention |
Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom |
| abstract |
An electrically and ionically conductive porous material including a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material. The thermoplastic binder immobilizes the moieties with respect to each other but does not substantially coat the moieties and forms the electrically conductive porous material. A wafer of the material and a method of making the material and wafer are disclosed. |
| priorityDate |
2004-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |