| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7e639c1b725b2743c700419191d2adf4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_82021eaeea693634d18d18cfbf66db3c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_92c3414251d8cd82efbea74d707c44ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_27a421d84227e9035c18a4e425ae2510 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10409
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-341
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0058 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 |
| filingDate |
2005-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1fa5bbb27e527f1f064dfe9767a5159
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83ebb699a54ecb3703723dcb632990af
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1e80d98a4c952d3464c62bcbee22225 |
| publicationDate |
2006-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2006032835-A2 |
| titleOfInvention |
Electrical circuit package with ceramic substrate, conductive platelet and conductor body |
| abstract |
An electrical circuit package comprises a ceramic substrate (1) with an electrical circuit pattern formed on one surface thereof, an opposite surface of the substrate being metallized, and an electrically conductive platelet (2) and a conductor body (3), arranged so that a first face of the platelet is soldered to the metallized surface of the substrate and an opposite face of the platelet is affixed in contact with the conductor body. A method of constructing the package is also described. |
| priorityDate |
2004-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |