| abstract |
A polishing liquid for CMP comprised of a composition loaded with, for example, a surfactant, a protective film forming agent and an inorganic salt capable of imparting a dissolution accelerating activity to enlarge a difference between polishing speed under non-load and polishing speed under load. By virtue of this polishing liquid for CMP, there can be simultaneously accomplished a speed increase for enhancing CMP productivity and wiring miniaturization/wiring planarization for layer multiplication. |