| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_79dbddc0d5746fc3db01ebc459aefb32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_43e9bc481473b7735d51aacc3e34fbba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_746f80c63604b1359eeee8de0f41886d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2889
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07378
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07342
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate |
2005-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77453056138fefbc4cccc87d7b2581d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d3050373668594e0ed1ca323f23e009 |
| publicationDate |
2006-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2006023741-A2 |
| titleOfInvention |
Method to build a wirebond probe card in a many at a time fashion |
| abstract |
Resilient spring contacts (140) for use in wafer test probing are provided that can be manufactured with a very fine pitch spacing and precisely located on a support substrate. The resilient contact structures (140) are adapted for wire bonding to an electrical circuit on a space transformer substrate (160). The support substrates (150) with attached spring contacts can be manufactured together in large numbers and diced up and tested before attachment to a space transformer substrate (160) to improve yield. The resilient spring contacts (140) are manufactured using photolithographic techniques to form the contacts on a release layer, before the spring contacts (140) are epoxied to the support substrate (150) and the release layer removed. The support substrate (150) can be transparent to allow alignment of the contacts and testing of optical components beneath. The support substrate can include a ground plane provided (152) beneath the spring contacts for improved impedance matching. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101034947-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009066979-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009066979-A3 |
| priorityDate |
2004-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |