Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_77a1f5fc0c4376a957e9fc040fb142bf http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_31fef0ddf27e9f67a7159907309a20e5 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31765 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L91-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31725 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J177-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J177-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J177-00 |
filingDate |
2005-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dbb25bfb12873a345294edc5aa17554f |
publicationDate |
2006-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2006017784-A1 |
titleOfInvention |
Polyamide adhesive and articles including the same |
abstract |
A hot melt adhesive composition that includes thermoplastic polyamide, adhesion promoter that includes at least one acid group, and wax having a melting point greater than 82°C. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/AU-2006295439-B2 |
priorityDate |
2004-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |