| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6307e62bbc5f81c5810d78ceb37b47b5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d8b31f130150277d53e13509863bdd0d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2891 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2874 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F19-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate |
2005-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1844969e460c09605bff4407920332e |
| publicationDate |
2005-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2005124652-A2 |
| titleOfInvention |
Localizing a temperature of a device for testing |
| abstract |
Wafers or other structures (150) comprising a plurality of dies or devices (166) are tested at non-ambient temperatures by inducing a first heat flux through a substantial portion of a surface (156) of the structure (150) to modify a temperature of the structure (150) and inducing a second heat flux through a local area of a surface (156) of the structure (150), proximate the device under test (166), to modify the temperature the device under test (166). |
| priorityDate |
2004-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |