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filingDate 2004-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac0b69740e09545e9e23a8fefa1d5e51
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publicationDate 2005-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2005111147-A1
titleOfInvention Thermoplastic resin composition with low coefficient of linear thermal expansion
abstract The thermoplastic resin composition according to the present invention comprises (A) a diene graft polymer prepared by grafting in emulsion polymerization 100 parts by weight of monomer mixture comprising 20-30% by weight of vinyl cyanide compound and 70-80% by weight of vinyl aromatic compound to 40-60 parts by weight of diene rubber; (B) a vinyl cyanide- vinyl aromatic copolymer having a weight-average molecular weight (Mw) of 100,000~200,000 prepared by copolymerizing 20~40 parts by weight of vinyl cyanide compound and 80~60 parts by weight of vinyl aromatic compound; (C) a vinyl cyanide- vinyl aromatic copolymer having a weight-average molecular weight(Mw) of 200,000~600,000 prepared by copolymerizing 20~40 parts by weight of vinyl cyanide compound and 80~60 parts by weight of vinyl aromatic compound; and (D) a N-substituted maleimide copolymer prepared by copolymerizing 20~60 parts by weight of a mixture of maleic anhydride and N-substituted maleimide and 40~80 parts by weight of a vinyl aromatic compound and/or a vinyl cyanide compound, wherein (A) is 15~30 parts by weight, (B)+(C) is 40~85 parts by weight, (D) is 0~30 parts by weight, and (B) : (C) is from 0 : 100 to 80 : 20. The thermoplastic resin composition of the present invention has low coefficient of linear thermal expansion.
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