| abstract |
A layered structure (24) produced by metallizing a substrate (18) including: (a) providing a transfer film including film layer and metal layer (16) bonded together by cured breakaway layer (14); (b) providing a substrate (18); (c) applying electron beam curable transfer adhesive (20) to a portion of the substrate (18); (d) securing the transfer film to the substrate, where the transfer adhesive (20) is between the metal layer (16) and substrate (18), forming an intermediate product; (e) passing the intermediate product through an electron beam curing apparatus to cure the transfer adhesive (20); and (f) removing the transfer film. In the metallized product (24), the cured breakaway layer (14) preferably has a cured elongation at break, in tension, of less than about 20%. Precise metallized edges are produced, e.g., edge variation of about ± 0.10 in., or better. The process can be utilized with total or selective metal transfer. |