| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7c263ba584f183fee85eca95936f82ab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8ba702599b6a5bb467bb526a4e76e403
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6df68b4b23a7e81e7caed183a098fe9e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dd6e66c74edca2fa01df778863745809
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f25d0bcbd6e114864f57addf73f37ae3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09718
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6616
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09618
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09809
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1903 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0251
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0222 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11C7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 |
| filingDate |
2005-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_686023e669ede92214452a25a07ec287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1dcbe6be69269ac9cbba97032fbe500
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de874acb4dc0f433bca99c0fb8a58e1a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1d1518f648c1821f024354442f62104 |
| publicationDate |
2005-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2005084089-A1 |
| titleOfInvention |
A radio frequency circuit board topology |
| abstract |
An interconnection structure for interconnecting circuitry on a first conductive layer to circuitry on a second conductive layer is provided. The interconnection structure of the present invention comprises a signal conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the signal conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. One feature of the present invention is that the plurality of ground vias can be modified, adjusting their diameters and their placement relative to the signal conductor via, in order to affect the overall characteristic impedance of the interconnection structure. This feature is useful when propagating high frequency signals between signal traces on different conductive layers of a printed circuit board. In view of the high frequencies used in today's wireless communication systems, the interconnection structure proposed aids in the practical implementation of radio frequency modules by mitigating the effects of impedance discontinuities ordinarily present at signal trace-to-via transition regions. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180135653-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102410197-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2435378-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2435378-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006065539-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006065539-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7394027-B2 |
| priorityDate |
2004-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |