| abstract |
Disclosed is a package board wherein a malfunction or error occurs even when a high-frequency IC chip, in particular an IC chip of more than 3 GHz is mounted. A conductor layer (34P) having a thickness of 30 μm is formed on a core substrate (30), and a conductor circuit (58) having a thickness of 15 μm is formed on a interlayer resin insulating layer (50). By forming the conductor layer (34P) thick, the volume of the conductor itself is increased, thereby reducing the resistance. In addition, by using the conductor layer (34) as a power supply layer, there can be improved the supply capacity of the power source to the IC chip. |