| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d260d6f30ce6c2e566acf02e5671c60e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ab096d14cbed82cad0fd2a278618262
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f757f0e0d2bddd24fd070f840be9fae6
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a3a6a67766afaa20f5d5178a9c34a4f2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_554b544aea57c2c3f14d614bbe402edf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e3c33039e3a8a5dbf9e4065e221ac7eb |
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76885 |
| classificationCPCInventive |
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-00
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| classificationIPCAdditional |
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| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C25-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B44C1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00
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| filingDate |
2005-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f79eb94c997fc8adaec4a0e4a8fb89c9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7fbf9b8993bac88a4d8b81171c0f608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fa7424f15ab1641ff1ac01f7d47dc32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4eb1a8dbe31a33d61ae50066ca9c221b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37badd60a349a8c868bd4320376da3a3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_162e0be59d4b3bde394401cc65661987
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e4b387d70c2e883858c433d88dfed2c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ca90b21d7fdccc4473407a382e407d0 |
| publicationDate |
2005-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2005065433-A2 |
| titleOfInvention |
Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates |
| abstract |
Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures (222) on dielectric or partially dielectric substrates (202). Certain embodiments deposit seed layer material (206) directly onto substrate materials while other embodiments use an intervening adhesion layer material (324). Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial (212) and structural (216) conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material (702), at least one conductive sacrificial material (706), and at least one dielectric material (704). In some embodiments the dielectric material is a UV-curable photopolymer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3195337-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10746612-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016019223-A1 |
| priorityDate |
2003-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |