| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6872388c4c1dc871f4503221142f2371
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ed1cf9f08811866294de365a4432358e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6aa6354b1c65e4293c46116b8fa3069c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-05 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J171-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68 |
| filingDate |
2004-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_baf1412446061557c94e8fcfcd3c05ac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cd7ae76031b047c98d6a30b4acd552b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c747a4acbb171546450a391df59e5f08 |
| publicationDate |
2005-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2005052085-A1 |
| titleOfInvention |
Hot melt adhesive composition |
| abstract |
[PROBLEMS] To provide an adhesive composition employed to fix a semiconductor wafer or the like onto a support base, which adhesive composition exhibits firm adherence of high thermal stability at the time of grinding operation but after the completion of grinding operation, is melted by heating to thereby permit easy detachment. [MEANS FOR SOLVING PROBLEMS] There is provided a hot melt adhesive composition comprising as a main component a crystalline compound of 50 to 300°C melting temperature, characterized in that the composition has a melting temperature width of 30°C or less and a melt viscosity of 0.1 Pa·s or below. It is preferred that the crystalline compound as the main component be an organic compound of 1000 or less molecular weight composed of C, H and O elements only, especially an aliphatic compound or alicyclic compound, and still especially a compound having a steroid skeleton and/or hydroxyl. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9011729-B2 |
| priorityDate |
2003-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |