| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_929ebaedebf4b9823b51d6a25d8e9ced
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9e1bf06f55de84b78abc9a057807f7eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ebbfd69dcc24b9f699da8924ecf16178
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cd727aa2b4e6c347aadd94971881d671 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2367-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2300-16 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-16 |
| filingDate |
2004-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e53716f56b4d4b68cce4db1710fe8350
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b3963d3bed3639a6f3e7fde934f2139 |
| publicationDate |
2005-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2005052062-A1 |
| titleOfInvention |
Resin composition and resin formed body |
| abstract |
Disclosed is a resin composition wherein hydrolysis is suppressed and discoloring at the time of heating is reduced. Also disclosed is a resin formed body wherein hydrolysis is reduced. This resin formed body enables to reduce quality deterioration of the contents. The resin composition contains a resin and a lamellar organic silicic acid wherein a substituted silyl group having a substituted or unsubstituted alkyl group is bonded to a lamellar polysilicic acid. The resin formed body can be obtained by shaping such a resin composition which contains a resin and a lamellar organic silicic acid wherein a substituted silyl group having a substituted or unsubstituted alkyl group is bonded to a lamellar polysilicic acid. |
| priorityDate |
2003-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |