| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e70c0aeade92d7571d955d3b90ea06e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_94244df0095114f0783da985ad28cac3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c763b03fa022ac67529adf8b2f1cdd8f |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H5-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23H5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D13-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 |
| filingDate |
2004-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0de71668f548deee6be97c03ec4ef6ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff1cc31253418fff8fd20a6d659486e1 |
| publicationDate |
2005-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2005042810-A2 |
| titleOfInvention |
Membrane -mediated electropolishing |
| abstract |
This invention provides a membrane-mediated electropolishing process for polishing and/or planarizing metal work pieces. The work piece is wetted with a low-conductivity fluid. The wetted work piece is contacted with a first side of a chargeselective ion-conducting membrane, wherein the second side contacts a conductive electrolyte solution in electrical contact with a cathode. Current flow between the cathode and the work piece electropolishes metal from the work piece. This process can be used for both pure metals and alloys, and provides several significant advantages over conventional electropolishing processes. This invention also provides an apparatus useful in the membrane-mediated electropolishing process. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007123677-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101454105-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013245391-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013032593-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013040406-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006119058-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7691250-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007123677-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009534523-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7598175-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110449676-A |
| priorityDate |
2003-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |