http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005028537-A1

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filingDate 2004-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2220c61afb4ed91c3e84f9670cf63489
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publicationDate 2005-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2005028537-A1
titleOfInvention Photocuring resin composition containing organic polymer having epoxy group and/or oxethane group-containing silicon group at end, and method for producing same
abstract A novel photocuring composition is disclosed which contains an organic polymer having an epoxy group and/or an oxethane group-containing silicon group at the end and a cationic photopolymerization initiator. For example, the photocuring composition is characterized by comprising an organic polymer (A) having an epoxy group and/or an epoxy group-containing silicon group at the end which polymer is obtained through addition reaction between an organic polymer having an unsaturated group at the end and a hydrosilane compound having an epoxy group and/or an oxethane group, and a cationic photopolymerization initiator (B).
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11414512-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014505274-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013216782-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5364267-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104540684-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018190415-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009024176-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008133204-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001163961-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7149479-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018190415-A1
priorityDate 2003-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 44.