http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005026040-A2

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filingDate 2004-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88a10bf2d16124ead10176c4be901aee
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publicationDate 2005-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2005026040-A2
titleOfInvention Wafer level capped sensor
abstract A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion. The pathway provides an electrical interface to the working portion.
priorityDate 2003-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 26.