| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c56d468fa0e00caae8cadb78d5744ada
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ad539f24964f005d2c95b2f6b75d3d4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38e72bf35b2c9cf15b388d0378b79abd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b5d5e554dee1ad796b5afb7c8e75a08d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1305 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3677 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
| filingDate |
2004-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7aaec44ea2c623461925814ab928085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60f5c58a90bf0d9b134f9cbf2cd71538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42ebb46a569d57be13be5357b3f69e6f |
| publicationDate |
2005-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2005018291-A2 |
| titleOfInvention |
Thermally enhanced electronic module with self-aligning heat sink |
| abstract |
A thermally enhanced electronic module (500) includes a thermally conductive case (502), a self-aligning thermally conductive heat sink (520) and an integrated circuit (IC) package (508). The case (502) includes an aperture (570) sized for receiving a portion of the heat sink (520). The IC package (508) includes a first surface and a second surface, opposite the first surface, and is mounted to a substrate (504) with the first surface of the IC package (508) facing the substrate (504). The second surface of the IC package (508) is in thermal contact with the heat sink (520), when the heat sink (520) is positioned in the aperture (570) and secured to the case (502). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102017206195-B4 |
| priorityDate |
2003-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |