| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5f2613b47d7720c6a0ee527f0b665d19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5f9a9ee6578908cf681cc67540723388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6994a02adc96c7a3d8557731d664dac8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_df2ab554c374dd379f27f4749facd483 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P40-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28D5-0011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-1462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0736
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28D1-221 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28D5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28D1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2004-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9da2cbd5ce14b36cca256861b4897c37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6241510fdc557d139c3bb94c0ad9af3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd1020468b9442da81ce537c6de05ab8 |
| publicationDate |
2005-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2005002779-A1 |
| titleOfInvention |
Method for separating flat ceramic workpieces with a calculated radiation spot length |
| abstract |
The invention relates to a method for separating a flat ceramic workpiece by the provocation of a separation crack that is the product of thermal stress, which occurs as a result of a temporal, local application of heat by means of a laser, along a desired separation line and a subsequent temporal, local withdrawal of heat by means of a coolant. The length of the radiation spot is calculated from the following formula: 1 = 8 x d x 24/TC, where 1 = length of the radiation spot; TC = thermal conductivity of the ceramic to be separated; and d = thickness of the ceramic to be separated. The length of the radiation spot produced by the laser on the workpiece is selected in accordance with the thermal conductivity of the ceramic and the thickness of the workpiece. For workpieces with a high residual stress in particular, method parameters such as laser power or the advance speed are modified over the course of the process to influence the intensity of the induced thermal stress. |
| priorityDate |
2003-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |