| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1543b2b19ec0e331a0dcd89888cbef5f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0239
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4626
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L65-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L65-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
2004-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6fe6383ee8b5105237d342c916acdf30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5797649dfd2d390d013e25a057841be8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8132c4234f7220666d13a8179dc1cf6d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd9d57fd714476ce8e1efc5b4286a049
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ddf861bb503a0a411071e7a683b1256 |
| publicationDate |
2005-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2005001932-A1 |
| titleOfInvention |
Dielectric composite material comprising benzocyclobutene which contains a filler in order to decrease the coefficient of thermal expansion |
| abstract |
A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8127331-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10645804-B2 |
| priorityDate |
2003-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |