| abstract |
The invention relates to a method for manufacturing an electronic thin-film component and an apparatus implementing the method. The invention also relates to an electronic thin-film component manufactured according to the method. A lowermost, galvanically uniform conductive layer of electrically conductive material is first formed on a substantially dielectric substrate, from which lowermost conductive layer conductive areas are galvanically separated from each other to form an electrode pattern. On top of said electrode pattern it is then possible to form one or several upper passive or active layers required in the thin-film component. According to the invention the separation of said lowermost conductive layer into an electrode pattern takes place by exerting on the lowermost conductive layer a machining operation based on die-cut embossing, i.e. embossing, wherein the relief of the machining member used in the machining operation causes a permanent deformation on the substrate and at the same time embosses areas from the conductive layer into conductive areas galvanically separated from each other. The invention is suitable for manufacturing thin-film components in a roll-to-roll process. |