| abstract |
A prepreg for printed wiring board characterized by using a brominated epoxy resin such that the peak intensity measured by an absorption spectrophotometer, at a wave number of 2100 to 2300 cm-1 of the infrared absorption spectrum is 5% or less of the peak intensity, measured similarly, of the benzene ring C=C bond near a wave number of 1600 cm-1, and that the point of inflection of the cured brominated epoxy resin is 120 to 150°C when measured by means of a differential scanning calorimetric analyzer. The prepreg for printed wiring board is excellent in hygroscopicity, heat-resistance, and desmearability as a printed wiring board material. A copper-clad laminated board using this is also disclosed. |