| abstract |
A method for increasing the bonding strength between a die (110) and a housing (202) for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method comprises depositing a plurality of clusters (220) of contact material onto a bottom surface (240) of the housing, placing the die onto the clusters, and subjecting the housing, the clustered contacts (228), and the die to a thermocompression bonding process. |