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filingDate 2004-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2004-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2004095538-A2
titleOfInvention Densifying deposited films on integrated circuits
abstract Densifying a deposited semiconducting film on a substrate is described. According to one embodiment of the invention, isostatic pressure (520) is used to densify the semiconducting film on the substrate.
priorityDate 2003-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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