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filingDate 2004-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae3706ed23be0af44b0679d0b1ab2948
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publicationDate 2004-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2004081262-A1
titleOfInvention Method of electroplating a workpiece having high-aspect ratio holes
abstract In order to electroplate workpieces comprising high-aspect ratio holes a method is disclosed comprising the steps bringing the workpiece and at least one anode into contact with a metal plating electrolyte, and applying a voltage between the workpiece and the anodes, to the effect that a current flow is provided to the workpiece. The current flow is a pulse reverse current flow having a frequency of at most about 6 Hertz. According to the frequency each cycle time comprises at least one forward current pulse and at least one reverse current pulse.
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