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filingDate 2004-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bfea807151180e681e0992d5c662611a
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publicationDate 2004-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2004081095-A8
titleOfInvention Electrically heatable pressure-sensitive adhesive compound
abstract The invention relates to an electrically heatable pressure-sensitive adhesive compound, to a method for the production thereof and to its use for producing pressure-sensitive adhesive tapes. The inventive pressure-sensitive adhesive compound comprises: (a) at least one adhesive constituent, in particular, based on an acrylate constituent, and; (b) at least one electrically conductive filler, particularly conductive carbon black. The preferably highly-crosslinked pressure-sensitive adhesive compound exhibits a high electrically induced heatability and is suited for producing pressure-sensitive adhesive tapes for adhering PTC elements.
priorityDate 2003-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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