| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_460c960cd09203c2f1727bc268569e14 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L91-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L93-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-0869 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L93-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L91-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J123-08 |
| filingDate |
2004-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_253a7c6f06443ab2718732f87a831102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba574b9133bb02fe0777275b874580b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f4855e8b5837b0a829f8e919caf29c7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70b5439c97e61ce9e1c5c3c820a50f56 |
| publicationDate |
2004-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2004076579-A1 |
| titleOfInvention |
Hot melt adhesive composition |
| abstract |
A low application temperature hot melt adhesive comprising an ethylene n-butyl acrylate copolymer that can be applied at temperatures down to about 80°C or less and is useful in case and carton sealing application. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2937975-A1 |
| priorityDate |
2003-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |