| abstract |
A method for interconnecting terminals so as to set up excellent electric connection between terminals such as opposed electrodes and a method for mounting a semiconductor device using the interconnecting method. An electrode pad (21) of a semiconductor chip (20) is opposed to a land (11) on a substrate (10) corresponding to the electrode pad (21), with a conductive adhesive interposed therebetween. Thereafter, the conductive adhesive is heated to a temperature which is higher than the melting point of the conductive particles contained in the conductive adhesive and at which curing of the resin is not completed, and conductive particles are fused together. The resin in the conductive adhesive can be completely cured, thereby securing the semiconductor chip (20) to the substrate (10). |