| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2b5fb10d32bd78405b090a07c6181d30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b2db223f64f2874005a88dee61bc0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20311f7fb24c1eefc8f15734eb0384e8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-542
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M14-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-022425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-2031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-2068 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M14-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-208
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-368
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0224 |
| filingDate |
2003-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_398b1fab512c3d7f1ef1e9e83f6493a0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_562025ce05c7604ed973e6cb55461336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3b8ee6797dee6fd653815dfde210c99 |
| publicationDate |
2004-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2004064192-A1 |
| titleOfInvention |
Photoelectric conversion element and process for fabricating the same, electronic device and process for fabricating the same |
| abstract |
A photoelectric conversion element employing a semiconductor electrode composed of fine semiconductor particles, in which the semiconductor electrode is formed by coating a transparent conductive substrate with paste containing a binder and dispersed with fine semiconductor particles, drying the paste, and then pressing the paste while heating at a temperature between 30°C and the softening point of the transparent conductive substrate or between 30°C and the lower one of the softening point of the transparent conductive substrate and the deactivation point of sensitization dye when the fine semiconductor particles carry the sensitization dye, thereby pressure fixing the fine semiconductor particles onto the transparent conductive substrate. |
| priorityDate |
2003-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |