| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1543b2b19ec0e331a0dcd89888cbef5f |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2003-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2a4d5fa4d2c0cdd965932bd273a3323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_581dc3975345bb7cef9ca6af0efccf3e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_715d615561275704eee5c8679c55ac20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6b568a1350d2a76f33f026387558c41
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_262ca05fd767897b183df76accce6cda
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2d1195b2e831a4a1fec7e9f60fda4a2 |
| publicationDate |
2004-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2004061162-A1 |
| titleOfInvention |
Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor |
| abstract |
The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or chemically depositing copper interconnects using these plating solutions. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007217751-A |
| priorityDate |
2002-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |