| abstract |
An electroless nickel plating bath for forming an anisotropically grown bump, characterized in that it comprises an anisotropic growth accelerator in an amount necessary to exhibit the effect to accelerate anisotropic growth; a method for forming an article having an anisotropically grown nickel bump; an article having an anisotropically grown nickel bump formed thereon; and an anisotropic growth accelerator for an electroless nickel plating bath. The electroless nickel plating bath allows the formation of bumps which have the form of a dome, have a high aspect ratio and are reduced in the variation in their heights, which bumps are required for corresponding with the tendency of broader range, more pins and a narrower pitch. |