| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d50a5d08fff80f620aa6f328cd9bc85e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0145 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0077
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00293 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 |
| filingDate |
2003-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d0658ec92d3dbec4a67cf29df81683a |
| publicationDate |
2004-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2004037711-A2 |
| titleOfInvention |
Processes for hermetically packaging wafer level microscopic structures |
| abstract |
A process for hermetically packaging a microscopic structure including a MEMS device is provided. The process for the present invention includes the steps of depositing a capping layer of sacrificial material patterned by lithography over the microscopic structure supported on a substrate, depositing a support layer of a dielectric material patterned by lithography over the capping layer, providing a plurality of vias through the support layer by lithography, removing the capping layer via wet etching to leave the support layer intact in the form of a shell having a cavity occupied by the microscopic structure, depositing a metal layer over the capping layer that is thick enough to provide a barrier against gas permeation, but thin enough to leave the vias open, and selectively applying under high vacuum a laser beam to the metal proximate each via for a sufficient period of time to melt the metal for sealing the via. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7982291-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8124435-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7932568-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8450816-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007060290-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8154094-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11346875-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8871606-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007022978-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007060289-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100446202-C
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I702669-B |
| priorityDate |
2002-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |