| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cd0bd73f9a1f946d3d751de79bde96f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ed1d2e2ed66ac91a774c0049972573d0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0216 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
2003-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7df4244be723bac53bb35af7d88d063d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e20d47925cec0da2f87e85a3af2d5fe1 |
| publicationDate |
2004-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2004031257-A1 |
| titleOfInvention |
Epoxy resin composition for sealing optical semiconductor |
| abstract |
An epoxy resin composition for sealing an optical semiconductor, which comprises (A) a bis-phenol type epoxy resin being represented by the formula (1) and containing the low molecular weight polymers of n = 0, 1, 2 and 3 in the total content of 10 wt % or more, (B) a terpene skeleton-containing polyhydric phenol curing agent prepared by adding two molecules of phenol or its derivative to one molecule of a cyclic terpene compound, (C) a curing accelerator and (D) at least one resin selected from the group consisting of epoxy resins except the component (A) and novolac resins as a curing agent; and an optical semiconductor element sealed by using a cured product of the epoxy resin composition. Said composition is excellent in workability and provides excellent productivity in the production of an optical semiconductor, and an optical semiconductor element sealed by using a cured product of said composition is also excellent in the resistance to the solder reflow operation after the moisture absorption thereof and the heat resistance in HC. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102061064-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2009119598-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8969490-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009119598-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101977984-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5510314-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5368707-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009091537-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008223004-A |
| priorityDate |
2002-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |