http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2004029718-A1

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filingDate 2003-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b88bc9d6350d48f224ba79cb79b77e15
publicationDate 2004-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2004029718-A1
titleOfInvention Highly sensitive and high-resolution photoresist for ion projection lithography
abstract The invention relates to a photoresist for ion projection lithography and to a method for structuring substrates during which the inventive photoresist is used. The photoresist contains a triphenylsulfonium perfluoroalkane sulfonate serving as a photo acid and triphenylsulfonium acetate serving as a photo base. The photoresist exhibits a very high exposure sensitivity and is thus excellently suited for use in ion projection lithography. A resolution of less than 90 nm can be obtained with a sensitivity of < 4 µC/cm2.
priorityDate 2002-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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