http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2004023213-A1
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fafacee4a47926bc6edd94ab50176f00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5da5c9bfa442032e8805f3639f365c99 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d68514a32e3a53b7a0c77aabb87304b8 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
filingDate | 2003-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3decd9e22ba475854bde8af691d7a0de http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dcc86c8ccc7392e675291760bdc35f00 |
publicationDate | 2004-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | WO-2004023213-A1 |
titleOfInvention | Radiation-sensitive negative-type resist composition for pattern formation and pattern formation method |
abstract | The radiation-sensitive negative-type resist composition for pattern formation containing an epoxy resin, a radiation-sensitive cationic polymerization initiator, and a solvent for dissolving the epoxy resin therein, characterized in that the resist composition, through drying, forms a resist film having a softening point falling within a range of 30 to 120 C and that the epoxy resin is represented by formula (1): (wherein R1 represents a moiety derived from an organic compound having k active hydrogen atoms (k represents an integer of 1 to 100); each of n1, n2, through nk represents 0 or an integer of 1 to 100; the sum of n1, n2, through nK falls within a range of 1 to 100; and each of 'A's, which may be identical to or different from each other, represents an oxycyclohexane skeleton represented by formula (2): (wherein X represents any of groups represented by formulas (3) to (5): and at least two groups represented by formula (3) are contained in one molecule of the epoxy resin)). |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006001518-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101103311-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7575851-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100881245-B1 |
priorityDate | 2002-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.