Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_01e48e78fadaaec045333f9ad5a6e0b5 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L69-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31507 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31551 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G64-081 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G75-23 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G64-1608 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G64-165 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L81-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0246 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-026 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L69-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L81-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G64-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G64-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G75-23 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09 |
filingDate |
2003-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1f5642b1d3469a67015c1b9fe8465bf |
publicationDate |
2004-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2004012239-A2 |
titleOfInvention |
Photosensitive bottom anti-reflective coatings |
abstract |
Anti-reflective compositions and methods of using these compositions to form circuits are provided. The compositions comprise a polymer dissolved or dispersed in a solvent system. Preferred polymers include polycarbonates, polysulfonyl esters, polycarbonate sulfones, and mixtures thereof. The compositions can be applied to a silicon wafer or other substrate to form a cured or hardened layer which is initially insoluble in typical photoresist developing solutions. Upon exposure to light, the cured or hardened layers become soluble in photoresist developing solutions so that the layer can be selectively removed along with the developed photoresist layer, thus eliminating the need for a separate removal step. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1757985-A4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1757985-A1 |
priorityDate |
2002-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |