| abstract |
The invention relates to a method wherein polymer compounds having functional groups A and B are used to seal surface-exposed pores of porous materials used during the production of chips. The invention also relates to compounds therefor and the use of said polymer compounds, whereby functional group A can bind to materials containing silicon and/or metal nitrides and the subsequent structure comprises: (R<2>-O-)3-nSiR<1>n-R<3>, wherein n=1 or 2, R<1> and R<2> are respectively an alkyl or aryl group, wherein R<1> and R<2> can be identical or different, and R<3> is an alkene or an arylene group; and functional group B can bind to copper metal, copper (I)-oxide and/or copper (II)-oxide and comprises one or more of the following structures: (1,2,3) and/or (4) wherein R<1> and R<3> are defined as in group A, and groups A, and B are connected to the polymer main chain by means of R<3>. |