http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03103894-A3

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
filingDate 2002-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bebefa260b4828f55ac876fc39024c58
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publicationDate 2004-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-03103894-A3
titleOfInvention COMPOSITIONS FOR MECHANICAL CHEMICAL PLANARIZATION OF COPPER
abstract The invention relates to mechanical chemical planarization ("CMP") of copper surfaces and CMP suspensions of copper comprising an oxidant, one or more hydroxylamine compounds and at least one abrasive. The hydroxylamine compositions can include hydroxylamine nitrate, hydroxylamine, hydroxylamine sulfate, ammonia salts and mixtures of these products. The oxidants can also include citric acid as a complexing agent for copper. Sulfuric acid and / or nitric acid make it possible to modify the pH of the oxidant, so that the chemistry of the hydroxylamine is acidic. Some embodiments relate to corrosion inhibitors, such as benzotriazole, 2,4-pentadione dioxime and / or 1,6-dioxaspiro [4,4] nonane 2,7-dione, as well as a radical inhibitor , preferably hydrazine. Colloidal silica and ground alumina are used as conventional abrasive components.
priorityDate 2001-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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